Motor Controller Resonance Vibration Study
Analysed an electrified performance vehicle motor controller hub on behalf of a small specialised design team using Finite Element Methods to determine likely resonance issues. Their customer required verification of the surviviability of the controller during vehicle lifetime, considering it’s close mouting to a high frequency motor.
Entropy were able to provide technical input on motor operation, expecting operating conditions and feedback on what studies should be provided and how data should be interpretted.
Keywords: performance automotive vehicle, resonance study, FEA analysis
VITA 48.2 FPGA Conduction Module
Supported a small embedded FPGA developer to design a full suite of mechanical parts for their Xilinx Kintex carrier modules. The customer are a streamlined FPGA developer and so entrusted Entropy to devlop a mechanical manufacturing and assembly pack for both 3U + 6U conduction and convection cards with FMC compatibility. Considerations were made for manufacturing cost during design with Entropy working closely with their manufacturing partner to ensure a high quality delivery.
Keywords: VPX, FMC, Vita 48.2, Vita 48.1, Xilinx Kintex Ultrascale, FPGA, conduction cooling, forced convection cooling, mechanical design, rugged embedded module
Small Form Factor Convection Optimisation Study
Worked with an Innovate Rugged Systems Provider to evaluate and improve the thermal capability of a modular rugged computer. By evaluating numerous mounting orientations, and considering the constraints around design for SWAP-C, we were able to show a thermal performance improvement of 14% over the initial findings. Thermal simulation results were verified against test.
Keywords: Small Form Factor, Intel COM EXpress, CPU, convection cooling, natural convection, CFD, thermal optimisation study
1/2 ATR Rack Vibration Profile Analysis
We supported a leading rugged electronics chassis developer in delivering a comprehensive vibration analysis on a 1/2 ATR rugged system on behalf of a leading Prime contractor, with the intent to verify that the unit would withstand extended operating profiles past what was previously certified. The study was required for flight worthiness certification and so delivery of the results needed to be highly accurate, reliable and information clearly communicated for leading technical users.
Keywords: 1/2 ATR, conduction cooling, structural analysis, FEA, random vibration, accelerated loading, flight worthiness, materiel safety factor
Rugged CPUGPU Fan Cooled System Design
Supported a leading hardware design and manufacture company in developing a thermal solution for a high performace and power density rugged development environment. With our support, the units cooling system was redesigned to dramatically improve performance from potentially significant throttling at operation to high power utilisiation, with 46% and 40% temperature reductions on the CPU and GPU respectively.
Keywords: Rugged graphics system, Intel Skylake, CPU, Nvidia Quadro P5000, GPU, forced convection cooling, fan selection, CFD, optimisation study
VITA 48.2 Coffee Lake Conduction Cooled Module
Supported a leading Tier 2 OEM in evaluating an existing 6U product’s performace and providing a complete thermal solution and mechanical manufacturing package capable of achieving a performace increase of +10°C at maximum operating power of the Intel Coffee Lake architecture.
Keywords: VME, Vita 48.2, Intel Coffee Lake, CPU, conduction cooling, rugged embedded module, CFD, Thermal Interface Materials
Small Form Factor GPU Convection Survey
Supported a Pioneering Advanced Robotics Developer with the development of a small form factor, passively cooled chassis for the Jetson Xavier NX architecture. With the support of good thermal engineering and accurate thermal simulation, we were able to boost the operating temperature window of the module by +25°C.
Keywords: Nvidia Jetson Xavier NX, GPU, passive convection cooling, natural convection, thermal optimisation, CFD
VITA 48.2 Heat Pipe Integration
Developed a functional heat pipe heatframe for a leading Tier 2 OEM with a supporting reliable supply chain for delivery of working units, and trained the engineering team on developing these designs themselves. This solution allowed maximum performance of the challenging Ice Lake CPU at +85°C cold wall.
Keywords: VPX, Vita 48.2, Heat pipes, Intel Ice Lake, CPU, conduction cooling, rugged embedded module, training, CFD, manufacturing
VITA 48.2 Skylake Conduction Cooled Module
Collaborated with a leading Tier 2 OEM to deliver a complete thermal solution and mechanical manufacturing package capable of achieving full performance of the Intel Tiger Lake CPU at up to +85°C cold wall.
Keywords: VPX, Vita 48.2, Intel Tiger Lake, CPU, conduction cooling, rugged embedded module, Thermal Interface Materials
VITA 48.2 Tiger Lake Conduction Cooled Module
Collaborated with a leading Tier 2 OEM to deliver a complete thermal solution and mechanical manufacturing package capable of achieving full performance of the Intel Tiger Lake CPU at up to +85°C cold wall.
Keywords: VPX, Vita 48.2, Intel Tiger Lake, CPU, conduction cooling, rugged embedded module, CFD, Thermal Interface Materials
